Patents

Method for Strengthening and Repairing Nails with Curable Compositions

The composition in US Patent No. 11,691,034 B2 includes a polymerizable material and the use of heat source.

Author Image

By: Christine Esposito

Editor-in-Chief

US Patent No. 11,691,034 B2 ( Jim Nordstrom, Linda Nordstrom, Susan Sheariss); Famous Names, LLC, Las Vegas, and Esschem, Linwood, PA, have patented a method for treating nail plates. It entails applying a penetrating composition to at least a portion of the surface of a nail plate, wherein the composition comprises a polymerizable material, at least one penetrating enhancer and a curing agent; allowing the penetrating composition to penetrate the nail plate below the surface of the nail plate; removing excess of the penetrating composition from the surface of the nail plate; and curing the penetrating composition which has penetrated below the surface of the nail plate.

The polymerizable material is selected from the group consisting of :hydroxyethyl methacrylate, hydroxypropyl methacrylate, butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, propyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate, ethoxyethyl methacrylate, 2-(ethoxyethoxy)ethyl methacrylate, acetoacetoxyethyl methacrylate, ethyl methacrylate, methyl methacrylate, fluoro methacrylate, furfuryl methacrylate, ethylene dimethacrylate, 1,12-docecanediol dimethacrylate, diethylene glycol methyl ether methacrylate, triethylene glycol ethyl ether methacrylate, 1,3-butylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, glycerol methacrylate, sorbitol methacrylate, alkyl methacrylate, trimethylolpropane trimethacrylate, tetraethleyene glycol dimethacrylate, dipentaerythritol trimethacrylate, polyether methacrylate, ethylene glycol dimethacrylate, HEMA acetoacetate, isopropylidenephenyl bisoxyhydroxypropyl methacrylate, lauryl methacrylate, methoxydiglycol methacrylate, PEG-4 dimethacrylate, tetrahydrofurfuryl methacrylate, pyromelletic glycidyl dimethacrylate, triethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, urethane methacrylate, diurethane methacrylate, urethane dimethacrylate, bis(glyceryl dimethacrylate) pyromellitate and combinations thereof.

The method includes placing the nail plate under a heat source.

Keep Up With Our Content. Subscribe To Happi Newsletters